内容简介

FEATURES
• Stability ΔR/R = 1 % for 1000 h at 70 ° C
• Pure tin solder contacts on Ni barrier layer
provides compatibility with lead (Pb)-free and lead
containing soldering processes
• Metal glaze on high quality ceramic
• Compliant to RoHS directive 2002/95/EC
• Halogen-free according to IEC 61249-2-21 definition
• AEC-Q200 qualified, rev. C compliant

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