内容简介

FEATURES
 •UL recognition file number E54214
 •Thin single in-line package
 •Glass passivated chip junction
 •High surge current capability
 •High case dielectric strength of 2500 VRMS
 •Solder dip 260 °C, 40 s
 •Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC

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