内容简介

FEATURES
 •Superectifier structure for high reliability
application
 •Cavity-free glass-passivated junction
 •Low forward voltage drop
 •Low leakage current, typical IR less than
0.1 µA
 •High forward surge capability
 •Meets environmental standard MIL-S-19500
 •Solder dip 260 °C, 40 s
 •Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC

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