内容简介

FEATURES
 •Very low profile - typical height of 1.0 mm
 •Ideal for automated placement
 •Glass passivated chip junction
 •Low forward voltage drop
 •Low thermal resistance
 •Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
 •AEC-Q101 qualified
 •Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC

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