内容简介

MECHANICAL SPECIFICATIONS
Solderability: 90 % coverage after 5 s dip in 235 °C solder
following 60 s preheat at 120 °C and type R flux dip
Resistance to Solder Heat: 10 s in 260 °C solder, after
preheat and flux above
Terminal Strength: 0.2 kg (0.44 lbs) for 30 s
Beam Strength: 0.2 kg (0.44 lbs)
Flex: 0.0788" [2.0 mm] min. mounted on 0.063" [1.6 mm]
thick PC board

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