内容简介

FEATURES
• Molded high temperature encapsulation
• Improved thermal management incorporated
into design
• Ideal for all types of current sensing, voltage
division and pulse applications including
switching and linear power supplies,
instrumentation, power amplifiers
• Proprietary processing technique produces
extremely low resistance values (down to
0.001 Ω)
• All welded construction
• Solid metal nickel-chrome or manganese-copper alloy
resistive element with low TCR (< 20 ppm/°C)
• Solderable terminations
• Very low inductance 0.5 nH to 5 nH
• Excellent frequency response to 50 MHz
• Low thermal EMF (< 3 μV/°C)
• Integral heat sink not utilized for resistance values less
than 0.0075 Ω
• Compliant to RoHS Directive 2002/95/EC

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