内容简介

FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Ultrafast recovery times for high efficiency
• Low forward voltage, low power loss
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in secondary rectification and freewheeling for
ultrafast switching speeds ac-to-ac and dc-to-dc
converters in high temperature conditions for both
consumer and automotive applications.

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