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IMPROVING BATWING POWER DISSIPATION

IMPROVING BATWING POWER DISSIPATION Allegro MicroSystems’ stepper motor ICs arepower ICs encapsulated in DIP (dual in-line), SOIC(small outline integrated circuit), and PLCC (plasticleaded chip carrier) packages. The silicon die isdirectly bonded to a heat-spreading lead frame(batwing) for

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  • 发布公司:Allegro
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  • 更新时间:2010-09-06 11:58:53
  • 官网:http://www.allegro.com

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